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New Computer Chip Cooling Technique from IBM

Overheating among computer chips, which become increasingly more powerful, denser and crammed into smaller spaces, is more and more common every day. IBM has found a way to solve this growing problem. Webmasters and computer users alike will want to have this product to help with the cooling of their computer chips. With a new and innovative technique, the company has found a way to draw twice as much heat off of hard-working computer chips.

?Electronic products are capable of amazing things, largely because of the more powerful chips at their heart. We want to help electronics makers keep the innovations coming. Our chip-cooling technology is just one tool at our disposal to help them do that,? said Bruno Michel, manager of IBM?s advanced thermal packaging research group. The new technique - high thermal conductivity interface technology ? takes a chip cap with a specially designed network of channels on its surface to allow the pressure applied when adding viscous paste between the chip and its cooling elements to be distributed uniformly.

Conventional technologies did not allow the paste to be spread so thinly, because doing so could damage the chip, IBM said in its announcement. Once the paste is added, the paste is spread more thinly than previously possible. It uses almost two times less pressure which results in a tenfold increase of heat transport through the interface. This is truly an amazing innovation and invention from IBM, and will help webmasters and computer owners all over the globe with the overheating of their chips.